- 品牌：
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- CUI Devices (1)
- Wakefield-Vette (1)
- Material：
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- Length：
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- Diameter：
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- Attachment Method：
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- Package Cooled：
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- Fin Height：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Material Finish：
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9 条记录
| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 TA... |
1 |
9,429
In-stock
|
提交询价 | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK COPPER ... |
1 |
3,000
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions Inc. | HEATSINK TO-220 BL... |
1 |
3,000
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions Inc. | HEATSINK TO-220 W/T... |
1 |
3,000
In-stock
|
提交询价 | ||
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
4,717
In-stock
|
提交询价 | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-3 BLA... |
1 |
3,127
In-stock
|
提交询价 | ||
|
|
Assmann WSW Components | HEATSINK ALUM AN... |
1 |
3,000
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
3,000
In-stock
|
提交询价 | ||
|
|
Wakefield-Vette | HEAT SINK ELLIP F... |
1 |
3,000
In-stock
|
提交询价 |