- 品牌：
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- Comair Rotron (1)
- CUI Devices (1)
- Product Status：
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- Material：
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- Width：
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- Length：
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- Diameter：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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12 条记录
| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 2.5W... |
1 |
30,819
In-stock
|
提交询价 | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 TA... |
1 |
3,231
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
3,000
In-stock
|
提交询价 | ||
|
|
Advanced Thermal Solutions Inc. | HEATSINK TO-220 DU... |
1 |
3,000
In-stock
|
提交询价 | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEAT SINK |
1 |
3,000
In-stock
|
提交询价 | ||
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
3,000
In-stock
|
提交询价 | ||
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
3,000
In-stock
|
提交询价 | ||
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
3,000
In-stock
|
提交询价 | ||
|
|
Comair Rotron | HEATSINK STAMP 9.... |
1 |
3,000
In-stock
|
提交询价 | ||
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
3,000
In-stock
|
提交询价 | ||
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
3,000
In-stock
|
提交询价 | ||
|
|
TE Connectivity AMP Connectors | 21MM HS ASSY ULTEM... |
1 |
3,000
In-stock
|
提交询价 |