- 品牌：
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- CUI Devices (1)
- Material：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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3 条记录
| 图片 | 型号 | 品牌 | 描述 | 起订量 | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
Assmann WSW Components | HEATSINK CPU XCU... |
1 |
3,000
In-stock
|
提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 30.... |
1 |
3,000
In-stock
|
提交询价 | ||
|
|
Assmann WSW Components | HEATSINK ALUM AN... |
1 |
3,000
In-stock
|
提交询价 |